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sim card emi filter array with esd protection cm1402 ?2010 scillc. all rights reserved. publication order number: may 2010 rev. 3 cm1402/d features ? functionally and pin compatible with cmd?s cspemi400 ? optiguard coated for improved reliability at assembly ? three channels of emi filtering, each with esd protection ? two additional channels of esd-only protection ? 10kv esd protection (iec 61000-4-2, contact discharge) on all pins ? 25kv esd protection (hbm) ? greater than 30db of attenuation at 1ghz ? 10-bump, 1.960mm x 1.330mm footprint chip scale package (csp) ? chip scale package features extremely low lead inductance for optimum filter and esd performance ? rohs-compliant, lead-free packaging applications ? sim card slot in mobile handsets ? i/o port protection for mobile handsets , notebook computers, pdas, etc. ? emi filtering for data ports in cell phones, pdas or notebook computers product description the cm1402 is an emi filter array with esd protecti on, which integrates three pi filters (c-r-c) and two additional channels of esd protection. the cm1402 has component values of 20pf-47 -20pf, and 20pf-100 -20pf. the parts include avalanche-type esd diodes on every pin, which provide a very high level of protection for sensitive electronic componen ts that may be subjected to electrostatic discharge (esd). the esd diodes connected to the filter ports are designed and characterized to safely dissipate esd strikes of 10kv, beyond the maximum requirement of th e iec 61000-4-2 international standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the pins are protected for contact discharges at greater than 25kv. the esd diodes on pins a4 and c4 ports are desig ned and characterized to safely dissipate esd strikes of 10kv, well beyond the maximum requirement of the iec 61000-4-2 international standard. this device is particularly well suited for porta ble electronics (e.g. mobile handsets, pdas, notebook computers) because of its small package format and easy-to-use pi n assignments. in particular, the cm1402 is ideal for emi filtering and protecting data lines from esd for the sim card slot in mobile handsets. the cm1402 incorporates optiguard coating which results in impr oved reliability at assembly.the cm1402 is available in a space-savi ng, low-profile chip scale package.
cm1402 rev. 3 | page 2 of 12 | www.onsemi.com electrical schematic
cm1402 rev. 3 | page 3 of 12 | www.onsemi.com pin descriptions type pin description a1 emi filter with esd protection for rst signal emi filter c1 emi filter with esd protection for rst signal a2 emi filter with esd protection for clk signal emi filter c2 emi filter with esd protection for clk signal b1 device ground device ground b2 device ground a3 emi filter with esd protection for dat signal emi filter c3 emi filter with esd protection for dat signal esd channel a4 esd protection channel - v cc supply esd channel c4 esd protection channel ordering information part numbering information lead-free finish bumps package ordering part number 1 part marking 10 csp CM1402-03CP ce note 1: parts are shipped in tape and reel form unless otherwise specified. specifications absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc power per resistor 100 mw dc package power rating 300 mw
cm1402 rev. 3 | page 4 of 12 | www.onsemi.com standard operating conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics 1 symbol parameter conditions min typ max units r 1 resistance of r 1 80 100 120 r 2 resistance of r 2 38 47 56 c capacitance v in = 2.5vdc, 1mhz, 30mv ac 16 20 24 pf v standoff stand-off voltage i = 10 a 6.0 v i leak diode leakage current v bias = 3.3v 0.1 1.0 a v sig signal voltage positive clamp negative clamp i load = 10ma i load = -10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 notes 2 and 4 25 10 kv kv v cl clamping voltage during esd discharge mil-std-883 (method 3015), 8kv positive transients negative transients notes 2,3, and 4 +12 -7 v v f c1 cut-off frequency z source = 50 , z load = 50 r = 100 , c = 20pf 77 mhz f c2 cut-off frequency z source = 50 , z load = 50 r = 47 , c = 20pf 85 mhz note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: clamping voltage is measured at the opposite side of the emi filter to the esd pin. for example, if esd is applied to pin a1, then clamping voltage is measured at pin c1. note 4: unused pins are left open.
cm1402 rev. 3 | page 5 of 12 | www.onsemi.com performance information typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 1. a1-c1 emi filter performance
cm1402 rev. 3 | page 6 of 12 | www.onsemi.com figure 2. a2-c2 emi filter performance
cm1402 rev. 3 | page 7 of 12 | www.onsemi.com performance information (cont?d) typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 3. a3-c3 emi filter performance
cm1402 rev. 3 | page 8 of 12 | www.onsemi.com figure 4. typical diode capacitance vs. input voltage (normalized to 2.5vdc)
cm1402 rev. 3 | page 9 of 12 | www.onsemi.com application information the cm1402 provides a bidirectional filter and protec tor for all the signals and the power line on the sim (subscriber identity module) card connector. sim cards are found in all gsm cellular phones and in some other handheld devices or card readers. the esd diodes protect the controller against possible esd strikes that may occur when the connector pins are exposed during direct contact, or during insertion of the sim card into the card slot. the emi filter suppresses all high-frequency noise, preventing the unwanted emi signals from both entering and exiting the main board. the signals that interface with the sim card are the reset, the clock and the bidirectional data i/o, as shown in typical application diagram for the sim card interface. note: one channel of the cm1402 with a zener diode is not shown on the diagram. figure 5. typical application diagram for the sim card interface for best filter and esd performa nce, both gnd bumps (b1, b2) of the cm1402 should be directly connected to the ground plane. a small capacitor of about 1 f is required next to the v cc pin of the sim connector in order to improve stab ility of the sim card supply rail.
cm1402 rev. 3 | page 10 of 12 | www.onsemi.com application information parameter value pad size on pcb 0.240mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.290mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.300mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature for lead-free devices using a lead-free solder paste 260c so ld er mask openi ng 0.29 0mm dia. no n-s old er mask de fin ed pad 0.24 0mm dia. sol der stenci l openi ng 0.30 0mm dia. figure 5. recommended non-solder mask defined pad illustration figure 6. lead-free (snagcu) solder ball reflow profile
cm1402 rev. 3 | page 11 of 12 | www.onsemi.com csp mechanical specifications cm1402 devices are packaged in a custom chip scale package (csp). dimensions are presented below. for complete information on csp packaging , see the california micro devices csp package information document. package dimensions package custom csp bumps 10 millimeters inches dim min nom max min nom max a1 1.915 1.960 2.005 0.075 4 0.0772 0.0789 a2 1.285 1.330 1.375 0.050 6 0.0524 0.0541 b1 0.495 0.500 0.505 0.019 5 0.0197 0.0199 b2 0.245 0.250 0.255 0.009 6 0.0098 0.0100 b3 0.430 0.435 0.440 0.016 9 0.0171 0.0173 b4 0.430 0.435 0.440 0.016 9 0.0171 0.0173 c1 0.180 0.230 0.280 0.007 1 0.0091 0.0110 c2 0.180 0.230 0.280 0. 0071 0.091 0.0110 d1 0.575 0.644 0.714 0.022 6 0.0254 0.0281 d2 0.368 0.419 0.470 0.014 5 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters a b c 1 c1 b1 a1 c2 dimensions in millimeters d1 d2 a2 bottom view side view 2 b2 b4 34 0.30 dia. solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) b3 package dimensions for cm1402 chip scale package
cm1402 rev. 3 | page 12 of 12 | www.onsemi.com csp tape and reel specifications part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 cm1402 1.96 x 1.33 x 0.644 2.08 x 1. 45 x 0.711 8mm 178mm (7") 3500 4mm 4mm figure 8. tape and reel mechanical data on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes witho ut further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any parti cular purpose, nor does scillc assume any liability arising out of the application or use of any pr oduct or circuit, and specific ally disclaims any and all liability, including without li mitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or spec ifications can and do vary in different applications and actu al performance may vary over time. all operating parameters, including ?typicals? must be validated for each custom er application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not de signed, intended, or authorized for use as components in systems intended for surg ical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reason able attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303-675-2175 or 800-344-3860 toll free usa/canada fax : 303-675-2176 or 800-344-3867 toll free usa/canada email : orderlit@onsemi.com n. american technical support : 800-282-9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81-3-5773-3850 on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative

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